Single Side Board, FR4 TG135 Material. copper thickness 1oz finished. LF-HASL surface treatment with green solder mask. board thickness 0.6+/-0.1mm. Min.line width/Min.line spacing 0.15/0.15mm. E-test: 100% 30up with routed&v-cut. No x-out allowed.
Single Side Board, FR4 TG135 Material. copper thickness 1oz finished. LF-HASL surface treatment with green solder mask. board thickness 0.6+/-0.1mm. Min.line width/Min.line spacing 0.15/0.15mm. E-test: 100% 30up with routed&v-cut. No x-out allowed.
Single Side Board Single Side Board,Single Sided PCB,Single Sided PCB Board,Single Layer PCB Orilind Limited Company , https://www.orilind.com
The annual growth rate of 12-inch capacity of TSMC this year has increased from 17% at the beginning of the year to 21%, and the capacity has increased by 20% for two consecutive years. This shows that the orders for mobile communication chips are strong, and the demand for 28nm process capacity is very large. Keep an eye on the operation and maintain high-end.
Credit Suisse expects that TSMC's capacity utilization rate will fall in December or early next year, at least one month ahead of the original estimate. This quarter's revenue decline is around 5%, which is worse than the company's expected recession. 7% to 9% of the ideal, the first quarter of next year's revenue quarter of the decline of only 3%, better than the market expected quarterly recession of 6%.
TSMC’s capital expenditure this year is about 8.3 billion U.S. dollars, and its capital expenditure will fall to 8 billion to 8.5 billion U.S. dollars next year. The industry believes that the possibility of moving closer to 8.5 billion U.S. dollars is high, and it is in line with plans for continued expansion of capacity next year. 
The single side boards are generally simple, so the production process is simplified and the cost is low.
A lot of PCB boards are made as FR4, and some of the low-end products are made as CEM-1
TSMC's monthly capacity of 12-inch chips in the first half of next year may exceed 400,000
It is reported that TSMC's monthly capacity of 12-inch chips will exceed 400,000 for the first time in the first half of next year in response to the demand of mobile chip customers. TSMC is actively expanding its 12-inch capacity, with 28nm as the main force for expansion, and focusing on the production of Zhongke Fab15. After 28nm was first mass-produced in October last year, the monthly volume was reduced from less than 1,000 pieces. In the first quarter of this year, 5,000 films were officially broken through 10,000 in the second quarter. At the end of this year, 70,000 films were seen, and the progress was ahead.