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Molex updates DDR4 DIMM socket
Molex has expanded its product lineup by introducing DDR4 DIMM sockets in both pneumatic and standard versions, offering design engineers greater flexibility, improved performance, and cost-effective solutions. The pneumatic socket options feature through-hole termination, streamlined latches, and optimized housings that enhance airflow and save valuable board space. Meanwhile, the standard models provide three different termination types: crimp-on for solderless assembly, surface mount for PCB traces, and via-based connections ideal for cost-sensitive applications.
All Molex DDR4 DIMM sockets are fully compliant with JEDEC standards and support a wide range of memory modules, including UDIMM, RDIMM, and LRDIMM. These sockets are specifically designed for high-speed data centers, computing systems, telecom infrastructure, and network servers, offering higher data rates and lower operating voltages compared to DDR3. Additionally, they incorporate advanced moisture-resistant and high-temperature nylon materials, ensuring reliable performance during demanding thermal processes.
Poox WaiKiong, Global Product Manager at Molex, stated, “Our customers are looking for interconnect solutions that offer design flexibility and cost efficiency without compromising on reliability—especially for 24/7 operations with minimal downtime. With a variety of products that reduce connector footprints, Molex delivers superior electrical performance over DDR3, meeting diverse customer needs. Our innovative materials help minimize yield loss, leading to better cost savings and faster time-to-market.â€
The crimp-type DDR4 DIMM sockets enable a more cost-effective and efficient solderless process, eliminating the risks associated with thermal cycling that can damage PCBs or degrade component performance. All connectors feature an ergonomically designed latch that improves usability and provides strong resistance against mechanical stress and vibration. The dual-ended leads ensure smooth module insertion, while the studs on the substrate simplify solder joint inspection, measurement, and rework. The shaped contact terminals prevent breakage and reduce stress on the housing during insertion, ensuring long-term durability and supporting up to 25 plug cycles.
These sockets also have a smaller pitch (0.85 mm) than their DDR3 counterparts, making them highly compatible with lead-free and halogen-free manufacturing processes. Molex offers gold-plated DDR4 DIMM sockets in two thicknesses—0.76 and 0.38 μm—available in a range of housing colors, latch styles, and PCB thickness options. For more details, visit the official Molex website at [http://?key=ddr4_dimm_sockets&channel=products&chanName=family&pageTitle=Introduction&utm_source=prssorch&utm_medium=prrelease&utm_campaign=data&WT.mc_id=A02658](http://?key=ddr4_dimm_sockets&channel=products&chanName=family&pageTitle=Introduction&utm_source=prssorch&utm_medium=prrelease&utm_campaign=data&WT.mc_id=A02658). To stay updated on Molex’s latest products and industry solutions, subscribe to the Molex Newsletter today.