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Molex updates DDR4 DIMM socket
Molex has expanded its product portfolio by introducing DDR4 DIMM sockets in both pneumatic and standard versions, offering design engineers greater flexibility, improved performance, and cost efficiency. The pneumatic socket options are designed with through-hole termination, streamlined latches, and optimized housings to enhance airflow and save space. On the other hand, the standard models provide three different termination types: crimp-on for solderless assembly, surface mount for PCB trace integration, and via-based connections for budget-friendly applications.
All Molex DDR4 DIMM sockets comply with JEDEC standards and support UDIMM, RDIMM, and LRDIMM memory configurations. These connectors are ideal for data centers, computing systems, telecom equipment, and network servers that require higher data transfer rates and lower operating voltages compared to DDR3. Additionally, they feature advanced moisture-resistant and high-temperature nylon materials with a low thermal expansion coefficient, ensuring reliable performance during high-temperature manufacturing processes.
Poox WaiKiong, global product manager at Molex, stated, "Our customers are looking for interconnect solutions that offer design flexibility, cost savings, and 24/7 reliability. With our range of products, we help reduce connector footprints, freeing up valuable PCB space while delivering superior electrical performance over DDR3. Our innovative materials also help minimize yield loss, leading to significant cost reductions and faster delivery times."
Crimp-type DDR4 DIMM sockets offer a more cost-effective and efficient process by eliminating the need for soldering, thus reducing thermal stress on the PCB and preserving component performance. The ergonomic design of the socket latch improves usability and provides strong resistance against tearing and vibration. The double-ended leads allow for smooth module insertion, while the studs on the substrate make solder joint inspection, measurement, and rework easier. The shaped contact terminals prevent damage during insertion, enhancing connector durability and supporting up to 25 plug cycles.
These sockets also have a smaller pitch (0.85 mm) than DDR3 counterparts, ensuring excellent compatibility with lead-free and halogen-free manufacturing processes. Molex offers gold-plated DDR4 DIMM sockets in two thicknesses—0.76 μm and 0.38 μm—available in various housing and latch colors, as well as different PC tail lengths and PCB thicknesses. For more details, visit Molex’s official website or subscribe to their newsletter for updates on other industry-leading products and solutions.