DIY: Daniel teaches you to assemble a drone

After 14 years of stealing, Wang Feng’s last headline opportunity, the drone continued to be hot for 15 years. As the public's attention continues to heat up, more and more drone enthusiasts have started to launch drones of major brands, but there are always a few friends who love hands-on, they like to set up a team. Man-machine. Keke, of course, Zhijujun also has this idea, but the drone is too high-end, so that there is no clue, nowhere to start. Until recently, I met a big cow who had been playing the drone for more than two years. It was originally that the group had no one to play with, and after talking with it, it was only awkward and suddenly awakened.

"The one machine is not cost effective."

When it comes to the major brands of drones, Wang Ming believes that "one machine is not cost-effective." For those who want to fly directly to drones and play aerial photography, the all-in-one may be a good choice. However, for a newcomer who wants to play a drone but is not very wealthy, it is a good choice to set up a drone.

"Patience, concentration, care, and carefulness can be assured."

If you really decide to go to your own DIY drone, you must do it.

Five major parts

"Rack, power, battery, flight control, remote control, not the aerial photography on these five parts. Aerial photography also has a camera, pan/tilt, picture transmission and monitor, and the double will add a cloud platformer."

frame

The rack is the main part of the drone. Once you have determined the rack, you can determine the type and number of all the parts you have.

Take DJI, Flame Wheel F550 as an example

The assembly drawing can be used on some big drone websites to find similar usage according to your own requirements.

HDI is the English abbreviation for High Density Interconnector. High-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From the first 32-bit computer from HP in 1985 to the large client server with 36 sequential multi-layer printed boards and stacked micro-vias, HDI/mini via technology is undoubtedly the future PCB architecture. Smaller ASICs and FPGAs with smaller device spacing, I/O pins, and embedded passives have shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, which drives Strong demand for HDI/mini vias.
HDI process
First-order process: 1+N+1
Second-order process: 2+N+2
Third-order process: 3+N+3
Fourth-order process: 4+N+4

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