Lattice Semiconductor recently announced that Ximmerse, a leading provider of mobile virtual reality (VR) interactive solutions, will integrate Lattice’s ECP5 FPGA for 3D visual processing. The ECP5 FPGA is praised for its low power consumption, compact size, and cost-effectiveness, making it an ideal choice for smart connectivity and performance acceleration. This technology helps deliver energy-efficient and low-latency solutions, which are essential in the fast-evolving AR/VR industry. As the demand for augmented reality (AR) and VR continues to grow, traditional application processors face limitations when handling complex content. Performing vision-based location tracking on these processors becomes increasingly difficult. In contrast, the ECP5 FPGA offers up to 85K LUTs—significantly more than a single application processor—within a small 10 x 10mm package. This allows for faster image processing with lower latency. Additionally, its programmable architecture and flexible I/O options enable Ximmerse to choose camera sensors from various vendors, ensuring adaptability across different product lines. Dai Jingwen, Technical Director at Ximmerse, shared, “Lattice has always been a key partner in overcoming design and performance challenges in mobile AR/VR systems. Their deep video expertise, excellent customer support, and highly flexible ECP5 FPGAs help us create smarter and more powerful solutions. We are excited about our ongoing collaboration and look forward to future innovations together.†Lattice Semiconductor offers a comprehensive range of FPGA solutions tailored for AR and VR applications. These include the WirelessHD module for ultra-low latency video transmission in wireless VR systems, CrossLink FPGA for camera interfacing and bridging, and the iCE40 FPGA, which supports real-time sensor-based position tracking. These products are designed to meet the growing needs of immersive technologies. Ying Chen, Senior Business Development Director at Lattice Semiconductor, added, “From AR/VR systems to robotics, drones, machine vision, and smart surveillance cameras, we’ve seen our small, low-power, and low-latency FPGAs being used in a wide array of cutting-edge applications. This is just the beginning, and we’re confident in the future of innovation and design driven by our technology.†Ximmerse currently offers both inbound and outbound tracking solutions, and has established partnerships with major industry leaders such as HTC. With continued investment in R&D and strategic collaborations, the company is well-positioned to lead the next wave of mobile VR advancements.
Semiconductor Chip Carrier can be divided into thermo-electric modules, and the power electronic substrates.
Thermo-electric modules are plate-like semiconductor cooling devices that work by using the movement of heat when a current flows through the junction of two different metals. Compact, lightweight, and Freon-free, they are used in climate control seats of automobiles, cooling chillers, optical communications, biotechnology, air conditionners, dryers and a variety of consumer electronic products.
Application of Thermo-electric module Manufacturing Technology for Heat Dissipation and Insulation Substrate
Generally, organic and metal substrates are used in the circuit boards of low-power home appliances and computers.
In particular, silicon nitride substrates are attracting attention for use in power modules of inverters and converters because of the increase in sales of HEVs and EVs. Chip Carrier Package,Ceramic Chip Carrier,Plastic Leaded Chip Carrier,Chip Carrier Socket SHAOXING HUALI ELECTRONICS CO., LTD. , https://www.cnsxhuali.com
However, alumina, aluminum nitride and silicon nitride substrates are used in heat radiation insulated substrates of power modules that handle high power.